About TT Electronics Semelab
High performance semiconductor solutions. We specialise in high reliability custom packaging components for critical applications and offer a wide product portfolio including discrete semiconductors, power modules and RF transistors. Our devices are typically used in key applications such as actuation, control systems, power generation and distribution.
Technical Resources
Product Range
Multi-Chip Arrays (MCAs)

Semelab MCAs offer a new way to build circuits from discrete components. They offer dramatic improvements in size, weight, reliability and cost compared to the same circuit built from separately packaged parts.
Key Features:
- Multiple discrete components in a single hermetic package
- Any technology: active, passive or mixed
- Customers´ circuits implemented. Range of standard circuits
- Small signal and power versions
Space Saving:
- High component density
- Light - typically 90% less weight
- Easy interconnection
- Up to 16 devices in one package
- Weight saving: 10% of TO18 or 66% of LCC1
- Space saving on the PCB
- Higher reliability: 0.22 failures per 106 operating hours
Product Documentation
Complementary Bipolar Power Transistors for High Power Audio

Specifically designed for high power audio amplifier output stages this new range of bipolar power transistors achieves unprecedented levels of power in a compact package. They allow a significantly reduced footprint of the amplifier output stage with outstanding levels of performance from both an audio and reliability perspective. They offer industry leading linearity and disoration performance with high gains and low losses.
| MG633x/MG941x | MG633x/MG941x Applications |
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| Advantages | MG6332/3 & MG9412/13 Advantages |
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Product Lineup
| Part Number | Polarity | Vceo (V) | Ic (A) | Pc (W) | Ft (MHz) | hFE (min) @10A | Package |
|---|---|---|---|---|---|---|---|
| MG6330 | NPN | 230 | 15 | 200 | 60 | 50 | TO-3P |
| MG9410 | PNP | 230 | 15 | 200 | 35 | 50 | TO-3P |
| MG6330-R | NPN | 260 | 15 | 200 | 60 | 50 | TO-3P |
| MG9410-R | PNP | 260 | 15 | 300 | 35 | 50 | TO-3P |
| MG6331 | NPN | 230 | 18 | 300 | 60 | 50 | TO-3P |
| MG9411 | PNP | 230 | 18 | 300 | 35 | 50 | TO-3P |
| MG6331-R | NPN | 260 | 18 | 300 | 60 | 50 | TO-3P |
| MG9411-R | PNP | 260 | 18 | 200 | 35 | 50 | TO-3P |
| MG6334K | NPN | 230 | 15 | 200 | 60 | 50 | TO-3 |
| MG9414K | PNP | 230 | 15 | 200 | 35 | 50 | TO-3 |
| MG6335K | NPN | 260 | 15 | 200 | 60 | 50 | TO-3 |
| MG9415K | PNP | 260 | 15 | 400 | 35 | 50 | TO-3 |
| MG6332 | NPN | 230 | 30 | 400 | 60 | 50 | TO-264 |
| MG9412 | PNP | 230 | 30 | 400 | 35 | 50 | TO-264 |
| MG6333 | NPN | 260 | 30 | 400 | 60 | 50 | TO-264 |
| MG9413 | PNP | 260 | 30 | 400 | 35 | 50 | TO-264 |
| MG6332K | NPN | 230 | 30 | 400 | 60 | 50 | TO-3 |
| MG9412K | PNP | 230 | 30 | 400 | 35 | 50 | TO-3 |
| MG6333K | NPN | 260 | 30 | 400 | 60 | 50 | TO-3 |
| MG9413K | PNP | 260 | 30 | 400 | 35 | 50 | TO-3 |
DLCC (Diode Leadless Chip Carrier)

Together with Charcroft’s expertise, the Diode Leadless Chip Carrier is another great product from our Aerospace range that works as a direct drop-in replacement for the standard MELF package.
Semelab are always striving to bring you the latest technologies which provide you with unique and innovative packaging solutions. Together with Charcroft’s expertise, the Diode Leadless Chip Carrier is another great product from our Aerospace range that works as a direct drop-in replacement for the standard MELF package.
Semelab have taken the original MELF outline and added new thermal and assembly features. And because they build and screen parts here in the UK, they are exempt from any ITAR restrictions.
Also offer Deep Dielectric Discharge protection and the Mil-19500 or ESA standard of screening flows.
Advantages:
- Fits on existing PCB layouts
- Lighter for weight critical applications
- Castellated design to ensure solder meniscus between board and component is visible
- Thermal vias incorporated in design to enhance thermal performance
- European manufactured (ITAR-free)
- Rectangular design to aid in PCB assembly
- Designed to be a more cost effective solution than our competition
- Many standard types in stock and custom devices available on short lead time
Features:
- Fully hermetic, ceramic diode leadless chip carrier
- Replacement for MELF-style standard product with enhanced features
- Optional deep dielectric discharge protection available
- Optional international aerospace and space screening flows
- Manufactured in accordance with MIL-19500 and ESA specifications
- Built using established space packaging technology (LCC/MCA structure)
High-temperature, high-reliability SiC power devices
Combining the unique attributes of Silicon Carbide and the advanced packaging techniques of Semelab, the SiC range offers unprecedented performance and reliability in the most extreme environments. Semelab Silicon Carbide parts are designed for use in motor drives, UPS, induction heating and SMPS, in applications such as down-hole drilling, aerospace engines and nacelles, defence and space applications. Optional screening levels and qualifications are available on the full range of parts.
| Part No. | Description | Voltage | Current | Package | Max Temp. (Tj) |
|---|---|---|---|---|---|
| SML10SIC06YC | Silicon Carbide Schottky diode | 600V | 10A | TO257-AA | 225°C |
| SML020DH12 | Silicon Carbide Schottky rectifier | 1200V | 20A | TO258-AA | 200°C |
| SML010FBDH06 | Silicon Carbide power Schottky rectifier diode bridge | 600V | 10A | TO258-D | 200°C |
| SML100M12MSF | Normally-off Silicon Carbide power JFET | 1200V | 24A | TO258-AA | 200°C |
| SML05SC06DLCC3 | SMT ultra-fast recovery power rectifier | 600V | 5A | DLCC-3 | 175°C |
SML25SCM650N2B SiC 650v N-Channel MOSFET
650v SiC MOSFET in a hermetic SMD1 (TO-276AB) package
Deisgned for tigh temperature applications
Screening options available
SML100M12MSF - Normally Off Power SiC JFET
Features
- RDS(on)max of 0.100
- High Temperature Operation Tj = 200°C
- Low Gate Charge and Intrinsic Capacitance
- Positive Temperature Coefficient and Temperature
- Independent Switching Behaviour
Applications
- SMPS
- Motor Drive
- UPS
- Induction Heating
SML010FBDH06 - 5-lead Power Schottky Full Bridge Rectifier
Features
- 600V, 10A Full Bridge Rectifier Configuration
- High Temperature Operation Tj = 200°C
- Effective Zero Reverse and Forward Recovery
- High Speed Low Loss Switching
- High Frequency Operation
- High-Reliability Screening Options Available
SML05SC06DLCC3 - SiC DLCC lightweight surface mount packaging
Features
- Lightweight packages
- High Temperature Operation (230°C)
- High performance design for smaller designs and increased power
- Improved switching and high frequency die for improved efficiency
- Grounded Lid for antistatic and deep dialectic protection
- Fully screened parts available
Applications
- Down-Hole High Temperature
- Space Level Screened Parts
- Aerospace Engines and Nacelles
SML10SIC06YC - SiC Schottky Diode
Features
- Semelab's Silicon Carbide (SiC) Schottky diodes exhibit low forward voltage and supurb high temperature performance
- Suitable for high-frequency hard switching applications, where system efficiency and reliability are paramount
- No reverse recovery time due to absence of minority carrier injection
SML020DH12 - Silicon Carbide Power Schottky Rectifier Diode
Features
- 1200, 20A (2x10A) Rectifier Diodes
- High Temperature Operation Tj = 200°C
- Effective Zero Reverse and Forward Recovery
- High Frequency Operation
- High Speed Low Loss Switching

















